MODEL 7001 Dipping Module Termination
 



Model 7001 includes:
 
- High quality termination for chips as            small as 0402
- Programmable control for insertion/withdrawal speeds, dip and blot type
- Accurate, uniform bandwidths
- Slow insertion into paste helps eliminate pinholes
- Built in programmed leveling, eliminates off-line chip leveling
- Totally enclosed system- reduces solvent evaporation/increases material life
- Precision ground metal doctor blade

  Mechanical Immersion Accuracy:
+/- 0.002" (+/- 0.05 mm)

Immersion Rate:
0.002" - 0.02"/sec.
(0.05–5 mm/sec.)

Withdrawal Rate:
0.002" - 0.02"/sec.
(0.05 - 5 mm/sec.)

Dwell Time:
Dip or blot: 0–999 sec.

Throughput:
Cycle rate 30–40 sec. per plate
(dependent upon process parameters)

Number of Programs Permanently Stored: 65

Reservoir Capacity:
300 grams minimum
(dependent upon required termination band)

Setup Time:
Less than 5 minutes

Cleanup Time:
Approximately 10 minutes

Carrier Plate:
Size: 7" x 11"

Changeover Time:
Approximately 10 minutes

Utility Requirements:
Power: Standard 220 V, 50/60 Hz, 1 q, 15 A
Compressed air: 45–80 psi, 5 cfm
(420 - 560 kPa, 0.15m3/min.)

Physical Dimensions:
Length: 26" (66 cm)
Width: 29" (74 cm)
Height: 31" (79cm)
Shipping Weight:
Approximately 350 lb. (159 kg)
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